Technical Excellence 2023
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In this project, I will share a summary of my technical project.
A comprehensive overview of the gold bump package process, visualized using Blender. This video showcases each step involved in creating the desired gold bump package, from initial design to final execution.
Excess metal was seen post plating process.
At the end of 2023, I submitted my Technical Excellence project focused on improving gold bump seepage for one of our customers. The issue was metal seepage observed post-plating. Our root cause analysis identified that the coating softbake and develop hard bake parameters were not optimized for the adhesion between the photoresist and its sputter layer.
To address this, we structured a Design of Experiments (DOE) to optimize the critical parameters influencing the photoresist behavior: the softbake temperature and the hardbake duration. We utilized statistical analysis methods to establish a factorial design, assessing the interactions between these variables. This approach enabled us to pinpoint the optimal conditions for minimizing metal seepage. Following the second DOE iteration, the results demonstrated a significant improvement in the adhesion quality, with no metal seepage observed. The optimized process parameters were validated through subsequent trials and confirmed their effectiveness in enhancing the photoresist adhesion.
To ensure these improvements were standardized, we updated the recipe specifications, revised the New Product Development (NPD) process flow, and extended the enhancements to other 300mm gold bump packages. This standardization helped in maintaining consistent quality and resolving the seepage issue across different production lines.
